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7 September 2011 The thermal dissipation of LED under the influence of ceramic porous film
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Abstract
The temperature had an important influence in the life time of light emitting diodes (LED). In this study, we fabricated the ceramic porous films, by vacuum sputtering, soldered the LED lamps to enhance both of the heat transfer and heat dissipation. In our samples, the ceramic enables transfer the heat from electric device to the aluminum plate quickly and the porous increase the quality of the thermal dissipation between the PCB and aluminum plate, as compared to the industrial processing. The ceramic films were characterized by several subsequent analyses, especially the measurement of real work temperature. The X-Ray diffraction (XRD) diagram analysis reveals those ceramic phases were successfully grown onto the individual substrate. The morphology of ceramic films was investigated by the atomic force microscopy (AFM). The results show porous film fabricated by vacuum sputtering has high sheet resistivity, critical load, and thermal conduction to the purpose. At the same time, it had transferred heat and limited work temperature, ~80°C, of LED successfully.
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Ming-Seng Hsu, Chung-Chih Chang, Feng-Lin Shyu, and Yau-Chyr Wang "The thermal dissipation of LED under the influence of ceramic porous film", Proc. SPIE 8120, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications V, 81201G (7 September 2011); https://doi.org/10.1117/12.893828
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