27 September 2011 New approach for pre-polish grinding with low subsurface damage
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For an optical surface to be properly prepared, the amount of material removed during polishing must be greater than the volume of grinding damage. An intermediate stage between loose abrasive grinding and polishing can reduce the total volume of subsurface damage. This results in less time and expense needed during the polishing phase. We have characterized the Prestos's coefficient and subsurface damage depth for 3M Trizact™ diamond tile pads and believe it can fit this intermediary role. Trizact shows a sizeable reduction in the overall subsurface damage compared to similar sized loose abrasives. This understanding of the abrasive behavior allows us to create a better grinding schedule that more efficiently removes material and finishing with less overall damage than traditional loose abrasives.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
James B. Johnson, James B. Johnson, Dae Wook Kim, Dae Wook Kim, Robert E. Parks, Robert E. Parks, James H. Burge, James H. Burge, } "New approach for pre-polish grinding with low subsurface damage", Proc. SPIE 8126, Optical Manufacturing and Testing IX, 81261E (27 September 2011); doi: 10.1117/12.893912; https://doi.org/10.1117/12.893912

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