27 September 2011 Package technology for microcavities
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Abstract
Although Microcavities are promising in a variety of novel devices, there is slow development in microcavity based practical devices due to the lack of the package technology. In this paper, for the first time, we demonstrate the package technology for the microcavity coupling system to promote the development of the microcavity based practical applications. The package process are illustrated in detail. The changes which result from the package are also discussed. In addition, the advantages of the packaged structure are characterized, including the Q maintenance, robustness and the convenience. These advantages make this packaged structure promising in microcavity based practical devices.
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Wen-Dong Zhang, Wen-Dong Zhang, Ying-Zhan Yan, Ying-Zhan Yan, Jun Liu, Jun Liu, Shu-Bin Yan, Shu-Bin Yan, Chen-Yang Xue, Chen-Yang Xue, Ji-Jun Xiong, Ji-Jun Xiong, } "Package technology for microcavities", Proc. SPIE 8126, Optical Manufacturing and Testing IX, 81261G (27 September 2011); doi: 10.1117/12.893474; https://doi.org/10.1117/12.893474
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