28 September 2011 Thermal-contact-conductance measurement for high-heat-load optics components at SPring-8
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Thermal contact in water-cooling or cryogenic cooling-cooling condition is used for forming a high-heat-load component at the synchrotron radiation beamline. In SPring-8, for example, cryogenic cooling is used for silicon monochromator crystal with an indium insertion metal at the interface between a copper block and a silicon crystal. To reduce the strain on the silicon crystal with a low contact pressure and a high thermal conductivity, we require a silicon-indium-copper system and an alternative insertion material such as a graphite foil. To measure the thermal contact conductance in a quick measurement cycle under various thermal-contact conditions, we improve the thermal-contact-conductance measurement system in terms of the setup facilitation, precise temperature measurement, and thermal insulation around a sample.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
T. Takeuchi, T. Takeuchi, M. Tanaka, M. Tanaka, Y. Senba, Y. Senba, H. Ohashi, H. Ohashi, S. Goto, S. Goto, } "Thermal-contact-conductance measurement for high-heat-load optics components at SPring-8", Proc. SPIE 8139, Advances in X-Ray/EUV Optics and Components VI, 813911 (28 September 2011); doi: 10.1117/12.894612; https://doi.org/10.1117/12.894612

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