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13 October 2011 Megasonic cleaning: possible solutions for 22nm node and beyond
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Megasonic energy transfer to the photomask surface is indirectly controlled by process parameters that provide an effective handle to physical force distribution on the photomask surface. A better understanding of the influence of these parameters on the physical force distribution and their effect on pattern damage of fragile mask features can help optimize megasonic energy transfer as well as assist in extending this cleaning technology beyond the 22nm node. In this paper we have specifically studied the effect of higher megasonic frequencies (3 & 4MHz) and media gasification on pattern damage; the effect of cleaning chemistry, media volume flow rate, process time, and nozzle distance to the mask surface during the dispense is also discussed. Megasonic energy characterization is performed by measuring the acoustic energy as well as cavitation created by megasonic energy through sonoluminescence measurements.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hrishi Shende, Sherjang Singh, James Baugh, Raunak Mann, Uwe Dietze, and Peter Dress "Megasonic cleaning: possible solutions for 22nm node and beyond", Proc. SPIE 8166, Photomask Technology 2011, 816614 (13 October 2011);

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