13 October 2011 Study on the soft defects related to dry etch process of phase shift mask
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Abstract
In mask manufacturing process, some soft defects generated through co-interaction of dry etch and PR coating are hard to be removed in the conventional cleaning or repair process. It is on MoSi layer with smooth surface (lower roughness than MoSi), very thin and higher transmittance than MoSi film, it looks like half-tone pin-hole. Also, the defects are hard to detect in the conventional PSM inspection tool because of its thin and higher transmittance. In this paper, the root cause and control method of dry etch related half-tone pin-hole like soft defect is studied.
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Young-Jin An, Young-Jin An, Jong-Min Kim, Jong-Min Kim, Byung-Sun Kang, Byung-Sun Kang, Dong-Heok Lee, Dong-Heok Lee, Sang-Soo Choi, Sang-Soo Choi, "Study on the soft defects related to dry etch process of phase shift mask", Proc. SPIE 8166, Photomask Technology 2011, 81661L (13 October 2011); doi: 10.1117/12.896776; https://doi.org/10.1117/12.896776
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