13 October 2011 Bottlenecks in data preparation flow for multi-beam direct write
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Technical problems with shrinking process node for semiconductor manufacturing has generated considerable interest in the use of multiple beams as an advance manufacturing technique in the context of direct write to mask / wafer. This paper examines the data preparation bottlenecks associated with this process. The various steps in the data preparation flow are described. Particular attention is paid to the large increase in data volume and the associated issues in processing power, transfer speed, storage requirements, and overall turn-around-time. Further, the use of commercial graphic processing units (GPUs) is examined as a possible solution to some of these issues and results of tests conducted as part of the MAGIC (MAskless lithoGraphy for IC manufacturing) initiative are summarized.
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Dan Hung, Dan Hung, Otto Meijer, Otto Meijer, Alex Zepka, Alex Zepka, "Bottlenecks in data preparation flow for multi-beam direct write", Proc. SPIE 8166, Photomask Technology 2011, 81662C (13 October 2011); doi: 10.1117/12.896954; https://doi.org/10.1117/12.896954


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