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13 October 2011The trade-offs between thin and thick absorbers for EUV photomasks
Through a series of experiments and simulation studies, this paper will explore the lithographic impact of absorber
thickness choice on an EUV photomask and highlight the trade-offs that exist between thick and thin absorbers.
Fundamentally, thinning the absorber modifies the intensity and phase of light reflected from the absorber while
simultaneously decreasing in the influence of feature edge topography. The decision to deploy a thinner absorber
depends on which imaging effect has a smaller impact after practical mitigation and correction strategies are employed.
These effects and the ability to correct for them are investigated by evaluating the absorber thickness impact on
lithographic imaging performance, stray light effects, topography effects, and CD variability. Although various tradeoffs
are described, it is generally concluded that thinning the absorber thickness below around 68 nm is not
recommended for a TaBN/TaBO absorber stack.
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Gregory McIntyre, Christian Zuniga, Emily Gallagher, John Whang, Louis Kindt, "The trade-offs between thin and thick absorbers for EUV photomasks," Proc. SPIE 8166, Photomask Technology 2011, 81663U (13 October 2011); https://doi.org/10.1117/12.898912