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30 September 2011 Wafer-level micro-optics: trends in manufacturing, testing, and packaging
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Abstract
Micro-optics is an indispensable key enabling technology (KET) for many applications today. The important role of micro-optical components is based on three different motivations: miniaturization, high functionality and packaging aspects. It is obvious that miniaturized systems require micro-optics for light focusing, light shaping and imaging. More important for industrial applications is the high functionality of micro-optics that allows combining these different functions in one element. In DUV Lithography Steppers and Scanners an extremely precise beam shaping of the Excimer laser profile is required. High-precision diffractive optical elements are well suited for this task. For Wafer-Level Cameras (WLC) and fiber optical systems the packaging aspects are more important. Wafer-Level Micro-Optics technology allows manufacturing and packaging some thousands of sub-components in parallel. We report on the state of the art in wafer-based manufacturing, testing and packaging.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Reinhard Voelkel, Kenneth J. Weible, and Martin Eisner "Wafer-level micro-optics: trends in manufacturing, testing, and packaging", Proc. SPIE 8169, Optical Fabrication, Testing, and Metrology IV, 81690C (30 September 2011); https://doi.org/10.1117/12.897114
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