8 September 2011 Optimization design and fabrication of a novel optical-readout uncooled thermal imaging chip
Author Affiliations +
Abstract
Infrared imaging systems are widely used in many fields, so it's of great importance to develop thermal imaging systems of independent intellectual property rights. In this paper, a novel MEMS optical readout uncooled thermal imaging chip was developed. The front-side-etching design with narrow windows shortened the etching time and greatly increased the yield. The theoretical thermal-mechanical analysis was carried out to optimize the structure parameters. Thermal conductance can be adjusted by removing part of the gold layer to compromise between the temperature response and time constant. The finite element simulation demonstrated that the performance of the pixel is in good agreement with the theoretical results, which gives a good support to the theoretical analysis. The pixels were successfully fabricated and released with high yield.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuxiu Zhou, Yuxiu Zhou, Hong Zhou, Hong Zhou, Yanxiang Liu, Yanxiang Liu, Yi Wang, Yi Wang, Tie Li, Tie Li, Yuelin Wang, Yuelin Wang, } "Optimization design and fabrication of a novel optical-readout uncooled thermal imaging chip", Proc. SPIE 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies, 819116 (8 September 2011); doi: 10.1117/12.900520; https://doi.org/10.1117/12.900520
PROCEEDINGS
9 PAGES


SHARE
RELATED CONTENT


Back to Top