8 September 2011 Research on bad pixel variation of IRFPA by high temperature storage and temperature shock
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Performance of IRFPA depends greatly on the amount and distribution of bad pixels. In this paper, general causes of bad pixel in IRFPA are analyzed. Most bad pixels of IRFPA can be classified into four types for flip-chip bonding structure. The amount of bad pixels in IRFPA often increases after long-term operation. This strongly affects application of IRFPA. High temperature storage and temperature shock are effective ways to expose these potential bad pixels in advance. High temperature storage and temperature shock are carried out on some IRFPA samples. Four kinds of variation for bad pixels are investigated. They are variations of amount, characteristics, bad pixels on margin and bad pixels in different IRFPA. Results show potential bad pixels damaged after these tests. New bad pixels are tested, analyzed and classified. Each type of bad pixel is corresponding to defect of specified manufacture procedure. This indicates the potential improving directions. Methods that could reduce bad pixels are briefly discussed. Results shown in this paper can help to improve manufacture technology of IRFPA and then the performance of infrared imaging system.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wei Wang, Wei Wang, Yang-yu Fan, Yang-yu Fan, Yue-nong Fu, Yue-nong Fu, Jin-chun Wang, Jin-chun Wang, Wei Wu, Wei Wu, Jing Wang, Jing Wang, Qiang Guo, Qiang Guo, Jun-ming Liu, Jun-ming Liu, } "Research on bad pixel variation of IRFPA by high temperature storage and temperature shock", Proc. SPIE 8193, International Symposium on Photoelectronic Detection and Imaging 2011: Advances in Infrared Imaging and Applications, 819328 (8 September 2011); doi: 10.1117/12.900297; https://doi.org/10.1117/12.900297

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