22 November 2011 Optimization for metal bonding technology of optical fiber sensor
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Proceedings Volume 8199, 2011 International Conference on Optical Instruments and Technology: Optical Sensors and Applications; 819910 (2011) https://doi.org/10.1117/12.904808
Event: International Conference on Optical Instruments and Technology (OIT2011), 2011, Beijing, Beijing, China
Abstract
In order to solve the problem of low reliability and strain transmission efficiency for optical fiber sensor packaged with epoxy adhesive, based on the particle diffusion mechanism, a system for metal bonding of optical fiber sensor was developed to research package technology of optical fiber sensor without adhesive. To improve the quality of metal bonding layer, orthogonal test of four levels was designed with four factors which were working distance, driving voltage, feeding rate, pressure of particle field and bonding strength between metal bonding layer and substrate was selected as the criterion of quality of metal bonding layer. The primary and secondary sequences of the influencing factors were acquired by the method of statistical analysis. The optimization results could be instructive to the research on metal bonding technology of optical fiber sensor.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hao Liu, Hao Liu, Weimin Chen, Weimin Chen, Peng Zhang, Peng Zhang, Jun Wun, Jun Wun, Li Liu, Li Liu, } "Optimization for metal bonding technology of optical fiber sensor", Proc. SPIE 8199, 2011 International Conference on Optical Instruments and Technology: Optical Sensors and Applications, 819910 (22 November 2011); doi: 10.1117/12.904808; https://doi.org/10.1117/12.904808
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