Paper
23 December 2011 Micro-channel drilling of Ni and Pt films on silicon by using laser beam interference ablation for solid oxide fuel cells
Mindaugas Gedvilas, Bogdan Voisiat, Simonas Indrišiūnas, Mindaugas Maciulevičius, Sigitas Tamulevičius, Brigita Abakevičienė, Viktoras Grigaliūnas, Gediminas Račiukaitis
Author Affiliations +
Proceedings Volume 8204, Smart Nano-Micro Materials and Devices; 82040D (2011) https://doi.org/10.1117/12.910247
Event: SPIE Smart Nano + Micro Materials and Devices, 2011, Melbourne, Australia
Abstract
Solid oxide fuel cells (SOFC) are widely studied because of their potential usage in power source applications. At present huge attention is paid to micro solid oxide fuel cells (μ-SOFC) based on thin film technologies with power capacity in the range of several watts. Porous nickel is an important part in many types of solid oxide fuel cells. This work presents experimental results of laser micro-channel formation in the 200 nm thick nickel and platinum films for the fuel cell membranes. The four-beam interference ablation was applied for fast and parallel formation of microchannel over a large area in thin metal film on a silicon substrate for μ-SOFC. Using this technique, regularly arranged circular holes with a period of 4.2 μm were formed in the 200 nm thick nickel and platinum films. The diameter of the holes ranged from 1.7 to 2.7 μm. The area where holes were ablated by a single laser exposure was approximately 250x250 μm. A silicon substrate was chemically etched from backside to release the patterned nickel film.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Mindaugas Gedvilas, Bogdan Voisiat, Simonas Indrišiūnas, Mindaugas Maciulevičius, Sigitas Tamulevičius, Brigita Abakevičienė, Viktoras Grigaliūnas, and Gediminas Račiukaitis "Micro-channel drilling of Ni and Pt films on silicon by using laser beam interference ablation for solid oxide fuel cells", Proc. SPIE 8204, Smart Nano-Micro Materials and Devices, 82040D (23 December 2011); https://doi.org/10.1117/12.910247
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KEYWORDS
Nickel

Silicon

Laser drilling

Laser ablation

Platinum

Silicon films

Pulsed laser operation

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