23 December 2011 Ten ways to destroy a prototype MEMS device
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Abstract
Prototyping a Micro Electro Mechanical System (MEMS) device is a very different process to that employed for a standard Integrated Circuit (IC) or Printed Circuit Board (PCB). While the manufacturing methods for MEMS devices largely derive from the IC industry MEMS present many unique manufacturability challenges. These challenges typically relate to two distinct features, specifically; mechanics of the device and the packaging of the device. This paper discusses some of the potential pitfalls in the manufacture of a MEMS prototype; more specifically the paper considers issues leading to low yield rates in a MEMS prototype developed by the authors and then discusses possible improvements to enable a better chance of success. This discussion first identifies some of the more significant MEMS sensor design features that contributed to a low yield and then presents design improvements that could significantly increase the yield. Following this is the identification of several issues involved in packaging the sensor, which had the effect of reducing the yield further; in this case improvements in the packaging are suggested. Also discussed are some general prototyping problems researchers may face that with careful planning may be avoided.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stephen van der Velden, Ian Powlesland, Jugdutt Singh, "Ten ways to destroy a prototype MEMS device", Proc. SPIE 8204, Smart Nano-Micro Materials and Devices, 82042E (23 December 2011); doi: 10.1117/12.903198; https://doi.org/10.1117/12.903198
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