12 January 2012 Reduction of the 355-nm laser-induced damage initiators by removing the subsurface cracks in fused silica
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Proceedings Volume 8206, Pacific Rim Laser Damage 2011: Optical Materials for High Power Lasers; 82061C (2012) https://doi.org/10.1117/12.903037
Event: Pacific Rim Laser Damage Symposium: Optical Materials for High Power Lasers, 2011, Shanghai, China
Abstract
The 355 nm laser-induced damage thresholds (LIDTs) of polished fused silica with and without the residual subsurface cracks were explored. HF based wet etching and magnetorheological finishing was used to remove the subsurface cracks. To isolate the effect of subsurface cracks, chemical leaching was used to eliminate the photoactive impurities in the polishing layer. Results show that the crack number density decreased from~103 to <1cm-2, and the LIDT was improved as high as 2.8-fold with both the subsurface cracks and the polishing layer being removed. Subsurface cracks play a significant role in laser damage at fluencies between 15~31 J/cm2 (355nm, 8ns). HF Etching of the cracks was shown to increase the damage performance as nearly high as that of the samples in which subsurface cracks are well controlled.
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Minghong Yang, Hongji Qi, Yuanan Zhao, Kui Yi, "Reduction of the 355-nm laser-induced damage initiators by removing the subsurface cracks in fused silica", Proc. SPIE 8206, Pacific Rim Laser Damage 2011: Optical Materials for High Power Lasers, 82061C (12 January 2012); doi: 10.1117/12.903037; https://doi.org/10.1117/12.903037
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