Passive alignment and soldering technique for optical components

Heinrich Faidel; Bastian Gronloh; Matthias Winzen; Erik Liermann; Dominik Esser; Valentin Morasch; Jörg Luttmann; Michael Leers; Dieter Hoffmann

doi:10.1117/12.906726

15 February 2012 Passive alignment and soldering technique for optical components

Heinrich Faidel, Bastian Gronloh, Matthias Winzen, Erik Liermann, Dominik Esser, Valentin Morasch, Jörg Luttmann, Michael Leers, Dieter Hoffmann

Author Affiliations +

Proceedings Volume 8235, Solid State Lasers XXI: Technology and Devices; 82351I (2012) https://doi.org/10.1117/12.906726
Event: SPIE LASE, 2012, San Francisco, California, United States

Abstract

The passive-alignment-packaging technique presented in this work provides a method for mounting tolerance-insensitive optical components e.g. non-linear crystals by means of mechanical stops. The requested tolerances for the angle deviation are ±100 μrad and for the position tolerance ±100 μm. Only the angle tolerances were investigated, because they are more critical. The measurements were carried out with an autocollimator. Fused silica components were used for test series. A solder investigation was carried out. Different types of solder were tested. Due to good solderability on air and low induced stress in optical components, Sn based solders were indicated as the most suitable solders. In addition several concepts of reflow soldering configuration were realized. In the first iteration a system with only the alignment of the yaw angle was implemented. The deviation for all materials after the thermal and mechanical cycling was within the tolerances. The solderability of BBO and LBO crystals was investigated and concepts for mounting were developed.

Citation Download Citation

Heinrich Faidel, Bastian Gronloh, Matthias Winzen, Erik Liermann, Dominik Esser, Valentin Morasch, Jörg Luttmann, Michael Leers, and Dieter Hoffmann "Passive alignment and soldering technique for optical components", Proc. SPIE 8235, Solid State Lasers XXI: Technology and Devices, 82351I (15 February 2012); https://doi.org/10.1117/12.906726

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