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23 February 2012 Applications of picosecond lasers and pulse-bursts in precision manufacturing
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Abstract
Just as CW and quasi-CW lasers have revolutionized the materials processing world, picosecond lasers are poised to change the world of micromachining, where lasers outperform mechanical tools due to their flexibility, reliability, reproducibility, ease of programming, and lack of mechanical force or contamination to the part. Picosecond lasers are established as powerful tools for micromachining. Industrial processes like micro drilling, surface structuring and thin film ablation benefit from a process, which provides highest precision and minimal thermal impact for all materials. Applications such as microelectronics, semiconductor, and photovoltaic industries use picosecond lasers for maximum quality, flexibility, and cost efficiency. The range of parts, manufactured with ps lasers spans from microscopic diamond tools over large printing cylinders with square feet of structured surface. Cutting glass for display and PV is a large application, as well. With a smart distribution of energy into groups of ps-pulses at ns-scale separation (known as burst mode) ablation rates can be increased by one order of magnitude or more for some materials, also providing a better surface quality under certain conditions. The paper reports on the latest results of the laser technology, scaling of ablation rates, and various applications in ps-laser micromachining.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ralf Knappe "Applications of picosecond lasers and pulse-bursts in precision manufacturing", Proc. SPIE 8243, Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XVII, 82430I (23 February 2012); https://doi.org/10.1117/12.913626
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