Laser processing is generally known for low thermal influence, precise energy processing and the
possibility to ablate every type of material independent on hardness and vaporisation
temperature. The use of ultra-short pulsed lasers offers new possibilities in the manufacturing of
high end products with extra high processing qualities. For achieving a sufficient and economical
processing speed, high average power is needed. To scale the power for industrial uses the
picosecond laser system has been developed, which consists of a seeder, a preamplifier and an
end amplifier. With the oscillator/amplifier system more than 400W average power and maximum
pulse energy 1mJ was obtained. For study of high speed processing of large embossing metal
roller two different ps laser systems have been integrated into a cylinder engraving machine. One
of the ps lasers has an average power of 80W while the other has 300W. With this high power ps
laser fluencies of up to 30 J/cm2 at pulse repetition rates in the multi MHz range have been
achieved. Different materials (Cu, Ni, Al, steel) have been explored for parameters like ablation
rate per pulse, ablation geometry, surface roughness, influence of pulse overlap and number of
loops. An enhanced ablation quality and an effective ablation rate of 4mm3/min have been
achieved by using different scanning systems and an optimized processing strategy. The max.
achieved volume rate is 20mm3/min.