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8 February 2012 HSQ resist for replication stamp in polymers
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We investigated an affordable, accurate and large scale production method to fabricate sub-wavelength grating structures by replication in polycarbonate substrates by hot embossing. We used hydrogen silsesquioxane (HSQ) a high resolution, binary, inorganic, negative electron beam resist, on silicon substrate to make a stamp for replication. We fabricated the stamp on silicon by using HSQ-resist without any etching process with simple process steps. The process starts by depositing an HSQ-resist layer on a silicon substrate and by a measurement of the desired film thickness by adjusting the spinning speed and time. The resist material is then subjected to e-beam writing followed by a heat treatment to enhance the hardness and to reveal properties analogous to solid SiO2 as a hot embossing stamp material. A comparison study is made with and without the etching process with different etching rates. We demonstrate that an effective and inexpensive stamp for thermal nano-imprint lithography (NIL) for optical gratings is provided without an etching process, which gives a uniform imprinting density over the entire grating surface and high imprint fidelity. The reflectance spectra of replicated grating structures are also shown to be in agreement with theoretical calculations.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
M. R. Saleem, P. A. Stenberg, M. B. Khan, Z. M. Khan, S. Honkanen, and J. Turunen "HSQ resist for replication stamp in polymers", Proc. SPIE 8249, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics V, 82490G (8 February 2012);

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