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14 February 2012 Programmed resist sidewall profiles using subresolution binary grayscale masks for Si-photonics applications
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Abstract
In this paper we present a 45-degree mirror created for optical applications utilizing CMOS high-volume manufacturing processes with a gray-scale lithography technique. The process that is presented here was done by creating a 3D pattern in the photoresist and then by transferring the photoresist profile to the Si/SiO2 substrate by specific dry etch processing. We discuss the optimization of the half-tone pattern to achieve the desired resist profile. We achieved smooth sidewalls with various sidewall angles and show that different 3D angles and profiles can be achieved and processed simultaneously.
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Ofir Gan, Paul Allen, Assia Barkai, Peter Buck, Brid Connolly, Harel Frish, and Massimiliano Pindo "Programmed resist sidewall profiles using subresolution binary grayscale masks for Si-photonics applications", Proc. SPIE 8249, Advanced Fabrication Technologies for Micro/Nano Optics and Photonics V, 82490W (14 February 2012); https://doi.org/10.1117/12.907275
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