Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices XI
Proceedings Volume 8250 is from: Logo
21-26 January 2012
San Francisco, California, United States
Front Matter
Proc. SPIE 8250, Front Matter: Volume 8250, 825001 (17 March 2012);
Reliability and Packaging
Proc. SPIE 8250, Assembly and interconnect formation in MEMS/MOEMS application, 825002 (2 February 2012);
Proc. SPIE 8250, Effects of dry plasma releasing process parameters and induced in-plane stress on MEMS devices yield, 825003 (15 February 2012);
Proc. SPIE 8250, Evaluation of surface control and durability CNT and ITO coated PET transparent electrode under different dry conditions, 825004 (15 February 2012);
Proc. SPIE 8250, Usage induced changes to surface topography and material properties in polysilicon MEMS electrothermal structures, 825005 (15 February 2012);
Proc. SPIE 8250, Planar refractive microlens arrays with high fill-factor fabricated by polymer replication technique, 825006 (15 February 2012);
MEMS Testing I
Proc. SPIE 8250, Axial phase measurements of light interacting with microstructures, 825007 (15 February 2012);
Proc. SPIE 8250, Nondestructive static and dynamic MEMS characterization using supercontinuum scanning white light interferometry, 825008 (15 February 2012);
MEMS Testing II
Proc. SPIE 8250, Reliability of high I/O high density CCGA interconnect electronic packages under extreme thermal environments, 82500A (15 February 2012);
Proc. SPIE 8250, Characterization of flourocarbon SAM coated MEMS tribogauge, 82500B (15 February 2012);
Proc. SPIE 8250, Characterization of a nanocoating using a MEMS tribogauge, 82500C (15 February 2012);
Special Session: Hot Industrial Topics in MEMS
Proc. SPIE 8250, The unsettled world of leak rate physics: 1 atm large-volume considerations do not apply to MEMS packages: a practitioner's perspective, 82500H (15 February 2012);
MEMS for Space: Joint Session with Conference 8252
Proc. SPIE 8250, MEMS technology for miniaturized space systems: needs, status, and perspectives, 82500I (15 February 2012);
Proc. SPIE 8250, MOEMS devices designed and tested for astronomical instrumentation in space, 82500J (15 February 2012);
Proc. SPIE 8250, Performance prediction and characterization of highly insulated microbolometers for space applications, 82500K (15 February 2012);
Poster Session
Proc. SPIE 8250, Enhanced terahertz transmission by surface plasmon resonance, 82500L (15 February 2012);
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