SPIE OPTO | 21-26 JANUARY 2012
Optoelectronic Integrated Circuits XIV
Proceedings Volume 8265 is from: Logo
21-26 January 2012
San Francisco, California, United States
Front Matter
Proc. SPIE 8265, Front Matter: Volume 8265, 826501 (6 March 2012);
Optical Interconnects in High Performance Computing: Joint Session with Conference 8267
Proc. SPIE 8265, Multicore fiber link demonstrating large bandwidth density for future multimode optical interconnects, 826503 (2 February 2012);
Nanophotonics for Optical Interconnects: Joint Session with Conference 8267
Proc. SPIE 8265, Multiprocessor silicon photonic interconnects: a systems perspective, 826505 (2 February 2012);
Silicon OEICs I
Proc. SPIE 8265, Advanced silicon device technologies for optical interconnects, 826506 (2 February 2012);
Proc. SPIE 8265, Recent advances in manufactured silicon photonics, 826507 (2 February 2012);
VLSI Photonics
Proc. SPIE 8265, Chip-scale demonstration of 3D integrated intrachip free-space optical interconnect, 82650C (2 February 2012);
Proc. SPIE 8265, Low-loss photonic wires defined by local oxidation of silicon (LOCOS), 82650D (2 February 2012);
Nanoscale and Quantum OEICs
Proc. SPIE 8265, Nanophotonics for datacom and telecom applications, 82650E (2 February 2012);
Proc. SPIE 8265, Identification of localized group-velocity dispersion of nanostructured silicon waveguide devices using white-light interferometry, 82650G (2 February 2012);
Trends in OEICs
Proc. SPIE 8265, Light guidance through void: silicon slot waveguides and their rigorous characterization, 82650I (3 February 2012);
Proc. SPIE 8265, A speckle-based CMOS sensor for arbitrary surface movement detection with correlated double sampling and gain error correction, 82650J (2 February 2012);
Proc. SPIE 8265, Time-and-frequency-domain modeling (TFDM) of hybrid photonic integrated circuits, 82650K (2 February 2012);
Proc. SPIE 8265, Integrated silicon photonic nanocircuits and technologies for optical interconnect and optical sensing, 82650L (2 February 2012);
Poster Session
Proc. SPIE 8265, Integration of 3D plasmonic devices with silicon-on-insulator-based optical circuitry, 82650N (2 February 2012);
Back to Top