2 February 2012 Transmitting part of optical interconnect module with three-dimensional optical path
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Proceedings Volume 8267, Optoelectronic Interconnects XII; 82671A (2012) https://doi.org/10.1117/12.909759
Event: SPIE OPTO, 2012, San Francisco, California, United States
Transmitting part of optical interconnection module with three-dimensional optical path is demonstrated. In this module, electronic-device and photonic-device are separated on the front and rear sides of SOI substrate. The key component of this module are 45° micro reflector and trapezoidal waveguide which are fabricated by single-step wet etching on front side of SOI substrate. High-frequency transmission lines for 4-channel × 2.5-GHz and VCSELs are constructed on rear side of SOI substrate. In this module, the measurement result of optical coupling efficiency is -8.09 dB, and the 1-dB alignment tolerances are 25 μm and 26 μm on the horizontal and vertical direction, respectively. Eye diagrams are measured at data rate of 1-Gbps and 2.5-Gbps with the 215-1 PRBS pattern and the clearly open eyes are demonstrated.
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Chia-Chi Chang, Chia-Chi Chang, Po-Kuan Shen, Po-Kuan Shen, Chin-Ta Chen, Chin-Ta Chen, Hsu-Liang Hsiao, Hsu-Liang Hsiao, Yen-Chung Chang, Yen-Chung Chang, Yun-Chih Lee, Yun-Chih Lee, Mount-Learn Wu, Mount-Learn Wu, } "Transmitting part of optical interconnect module with three-dimensional optical path", Proc. SPIE 8267, Optoelectronic Interconnects XII, 82671A (2 February 2012); doi: 10.1117/12.909759; https://doi.org/10.1117/12.909759

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