28 November 2011 Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology
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Proceedings Volume 8308, Optoelectronic Materials and Devices VI; 830824 (2011) https://doi.org/10.1117/12.905571
Event: SPIE/OSA/IEEE Asia Communications and Photonics, 2011, Shanghai, China
Abstract
A hybrid-integrated coherent receiver module has been achieved using flip-chip bonding technology, consisting of a silica-based 90°-hybrid planar lightwave circuit (PLC) platform, a spot-size converter integrated waveguide photodiode (SSC-WG-PD), and a dual-channel transimpedance amplifier (TIA). The receiver module shows error-free operation up to 40Gb/s and OSNR sensitivity of 11.5 dB for BER = 10-3 at 25 Gb/s.
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Jong-Hoi Kim, Joong-Seon Choe, Kwang-Seong Choi, Chun-Ju Youn, Duk-Jun Kim, Sun-Hyok Jang, Yong-Hwan Kwon, Eun-Soo Nam, "Hybrid-integrated coherent receiver using silica-based planar lightwave circuit technology", Proc. SPIE 8308, Optoelectronic Materials and Devices VI, 830824 (28 November 2011); doi: 10.1117/12.905571; https://doi.org/10.1117/12.905571
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