25 February 2012 Reconfigurable 2D cMUT-ASIC arrays for 3D ultrasound image
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This paper describes the design and implementations of the complete 2D capacitive micromachined ultrasound transducer electronics and its analog front-end module for transmitting high voltage ultrasound pulses and receiving its echo signals to realize 3D ultrasound image. In order to minimize parasitic capacitances and ultimately improve signal-to- noise ratio (SNR), cMUT has to be integrate with Tx/Rx electronics. Additionally, in order to integrate 2D cMUT array module, significant optimized high voltage pulser circuitry, low voltage analog/digital circuit design and packaging challenges are required due to high density of elements and small pitch of each element. We designed 256(16x16)- element cMUT and reconfigurable driving ASIC composed of 120V high voltage pulser, T/R switch, low noise preamplifier and digital control block to set Tx frequency of ultrasound and pulse train in each element. Designed high voltage analog ASIC was successfully bonded with 2D cMUT array by flip-chip bonding process and it connected with analog front-end board to transmit pulse-echo signals. This implementation of reconfigurable cMUT-ASIC-AFE board enables us to produce large aperture 2D transducer array and acquire high quality of 3D ultrasound image.
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Jongkeun Song, Jongkeun Song, Sungjin Jung, Sungjin Jung, Youngil Kim, Youngil Kim, Kyungil Cho, Kyungil Cho, Baehyung Kim, Baehyung Kim, Seunghun Lee, Seunghun Lee, Junseok Na, Junseok Na, Ikseok Yang, Ikseok Yang, Oh-kyong Kwon, Oh-kyong Kwon, Dongwook Kim, Dongwook Kim, } "Reconfigurable 2D cMUT-ASIC arrays for 3D ultrasound image", Proc. SPIE 8320, Medical Imaging 2012: Ultrasonic Imaging, Tomography, and Therapy, 83201A (25 February 2012); doi: 10.1117/12.911263; https://doi.org/10.1117/12.911263


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