15 November 2011 In-line monitoring of thermal deformation and surface topography of flip chip substrates
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Proceedings Volume 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation; 83211Q (2011) https://doi.org/10.1117/12.904766
Event: Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 2011, Yunnan, China
Abstract
In the manufacturing process of flip chip packaging, the IC chip would be subjected to a temperature increase to roughly 150°C. With the rise of temperature, the chip is induced to a series of deformations which lead to possible malfunction of the IC unit. Therefore, the investigation of in-line thermal deformation of the flip chip substrates in chip packaging process is important. In this study the thermal deformation and surface profile of flip chip substrates under thermal stress are simultaneously measured with a system composed of digital image correlation (DIC) and projection fringe techniques. DIC technique is implemented to measure the in-plane deformation distribution and strain tendencies of flip chip substrates while projection fringe method is used to grab the out-of-plane deformation and surface profile of the substrates. Experimental results show that the warpage effect of the substrates is obvious when subjected to thermal loading. Since the measurement system is very easy to be implemented, this combination of DIC and projection fringe technologies maybe one of the most possible techniques for the growing need of in-line thermal deformation monitoring in the production line of flip-chip packaging.
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Ming Chang, Wei-En Tsai, Jun-Yi Lin, Kai-Yong Jiang, "In-line monitoring of thermal deformation and surface topography of flip chip substrates", Proc. SPIE 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 83211Q (15 November 2011); doi: 10.1117/12.904766; https://doi.org/10.1117/12.904766
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