15 November 2011 A new and effective 3D measurement system for micro solder bump
Author Affiliations +
Proceedings Volume 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation; 83212J (2011) https://doi.org/10.1117/12.905072
Event: Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 2011, Yunnan, China
Abstract
Fringe projection with phase shifting technology has been widely used for micro solder bump inspection. Spherical solder bump is referred to as specular-dominant, mirror-like, metallic reflection. Specifically, the saturated area is placed on the top of the bump surface, it makes the height profile distort and could not interpret reliable height data. In this paper, we propose a new three-dimensional measurement system with circular motion that can easily evaluate relationship between projection angle and reflectance of the bump, tackling these issues. The proposed system without any additional polarizer and cameras, makes saturated pixels far away from the center of the solder surface so that most saturated pixels are placed on the out of the measuring target area by increasing projection angle. The accurate height profile and high repeatability are obtained as reliable measurement results with the optimal projection angle, and it shows high potential for practical micro bump inspection in field.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Heui Jae Pahk, Heui Jae Pahk, Zhu Cheng Li, Zhu Cheng Li, Jeong-Il Mun, Jeong-Il Mun, } "A new and effective 3D measurement system for micro solder bump", Proc. SPIE 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 83212J (15 November 2011); doi: 10.1117/12.905072; https://doi.org/10.1117/12.905072
PROCEEDINGS
7 PAGES


SHARE
Back to Top