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15 November 2011 Design and characterization of a chip defect inspection system during bonding process based on linear CCD imager
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Proceedings Volume 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation; 83212P (2011) https://doi.org/10.1117/12.905129
Event: Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 2011, Yunnan, China
Abstract
Defect occures for a few of chips during manufacture. If defect size is greater than the criterion of impacting chip quality, these unqualified chips have to be removed. Presently used chip defect inspection system is designed basing on frame CCD imagers. Some drawbacks exist for this system, such as pause image acquisition, mosaic processing for acquired frame images per chip before inspection, etc. Therefore, the efficiency and accuracy of defect inspection degrade seriously. So chip defect is now still inspected manually on production lines. This work presents the design and characterization of an inspection system to detect chip defects with high performance based on a linear CCD imager. Defects with size of greater than 15μm shall be detected, and moving speed of inspected chips shall be greater than 0.6m/sec. Thus, proposed system has the characteristics of having the resolution of 5μm and 10μm for optical lens and CCD imager respectively, image line rate of greater than 120 kHz. Chip edge is derived to achieve the high correctness of inspection. A novel algorithm to inspect defects size is also developed here. Proposed system has advantages of such as non-pause image acquisition, unnecessary image mosaic, etc. And inspection efficiency and accuracy will be substantially improved. Moreover, system can be operated automatically during bonding process to inspect chips quality.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ming-Fu Chen, Po-Hsuan Huang, Yung-Hsiang Chen, Ting-Ming Huang, and Ming Chang "Design and characterization of a chip defect inspection system during bonding process based on linear CCD imager", Proc. SPIE 8321, Seventh International Symposium on Precision Engineering Measurements and Instrumentation, 83212P (15 November 2011); https://doi.org/10.1117/12.905129
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