21 March 2012 Design considerations for UV-NIL resists
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Abstract
Design considerations for UV-NIL resists were investigated focusing on the major issues of ink-jetting performance, pattern formability, release property, and dry etching resistance. Regarding ink-jetting performance, small droplet inkjetting of 0.7pl was successfully demonstrated by adjusting the resist fluid property to the ink-jet coater and controlling the resist volatilization. Regarding pattern formability, a resist pattern was imprinted from a mold pattern of 28nm in width and 60nm in depth without pattern dimension change. It was thought that modulus control of the resist was more important than resist shrinkage in achieving excellent pattern formability. As for release property, resist with fluorine monomer and with non-reactive fluorine anti-sticking agent were compared. The results indicated that resist design has the capability to both reduce separation force and maintain a clear mold surface. The mold release agent decomposed with increasing number of imprint shots, but the low release force resist with non-reactive anti-sticking agent was able to control degradation of the mold release agent and thus improve release property endurance. Regarding etching resistance, it was found that increasing the ring parameter of resist is essential for high etching resistance, and resulted in improved etched pattern features of the substrate.
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Kazuyuki Usuki, Satoshi Wakamatsu, Tadashi Oomatsu, Akiko Hattori, Shinji Tarutani, Kunihiko Kodama, Hideto Tanabe, Kouji Shitabatake, "Design considerations for UV-NIL resists", Proc. SPIE 8323, Alternative Lithographic Technologies IV, 832305 (21 March 2012); doi: 10.1117/12.915812; https://doi.org/10.1117/12.915812
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