Imprint process performance for patterned media at densities greater than 1Tb/in2

Zhengmao Ye; Scott Carden; Paul Hellebrekers; Dwayne LaBrake; Douglas J. Resnick; M. Melliar-Smith; S. V. Sreenivasan

doi:10.1117/12.918042

21 March 2012 Imprint process performance for patterned media at densities greater than 1Tb/in2

Zhengmao Ye, Scott Carden, Paul Hellebrekers, Dwayne LaBrake, Douglas J. Resnick, M. Melliar-Smith, S. V. Sreenivasan

Proceedings Volume 8323, Alternative Lithographic Technologies IV; 83230V (2012) https://doi.org/10.1117/12.918042
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

The use of bit pattern media beyond densities of 1Tb/in² requires the ability to pattern dimensions to sub 10nm. This paper describes the techniques used to reach these dimensions with imprint lithography and avoid such challenges as pattern collapse, by developing improved resist materials with higher strength, and utilizing a reverse tone J-FIL/R process.

Citation Download Citation

Zhengmao Ye, Scott Carden, Paul Hellebrekers, Dwayne LaBrake, Douglas J. Resnick, M. Melliar-Smith, and S. V. Sreenivasan "Imprint process performance for patterned media at densities greater than 1Tb/in2", Proc. SPIE 8323, Alternative Lithographic Technologies IV, 83230V (21 March 2012); https://doi.org/10.1117/12.918042

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