Toward faster and better litho control in high-volume manufacturing

Chui-Fu Chiu; Chun-Yen Huang; Wen-Bin Wu; Chiang-Lin Shih; Healthy Huang; James Manka; DongSub Choi; Arthur Lin; David Tien

doi:10.1117/12.916409

5 April 2012 Toward faster and better litho control in high-volume manufacturing

Chui-Fu Chiu, Chun-Yen Huang, Wen-Bin Wu, Chiang-Lin Shih, Healthy Huang, James Manka, DongSub Choi, Arthur Lin, David Tien

Author Affiliations +

Proceedings Volume 8324, Metrology, Inspection, and Process Control for Microlithography XXVI; 832426 (2012) https://doi.org/10.1117/12.916409
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

As the cost of manufacturing high-end semiconductors continues to increase, the value of combining and streamlining metrology steps also increases. The two critical metrology steps for litho control are 1) overlay and 2) CD. In this study, the authors demonstrate the capability of just such a combination CD and Overlay metrology solution to improve not only the cost of manufacturing but also the quality of data and information feedback for better scanner control in high volume production. The authors demonstrate how using imaging and scatterometry technology on a single platform can provide a comprehensive litho control solution for both CD and overlay in the litho module. In the study, the authors will use full stack wafers from an advanced process node running in high volume manufacturing. Specifically, data will be generated using PROLITH for lithographic simulations for optimal target designs and then empirical data will be collected using the Archer 300 LCM from which optimal target selection and system performance will be determined and validated on wafers using this advanced process technology.

Citation Download Citation

Chui-Fu Chiu, Chun-Yen Huang, Wen-Bin Wu, Chiang-Lin Shih, Healthy Huang, James Manka, DongSub Choi, Arthur Lin, and David Tien "Toward faster and better litho control in high-volume manufacturing", Proc. SPIE 8324, Metrology, Inspection, and Process Control for Microlithography XXVI, 832426 (5 April 2012); https://doi.org/10.1117/12.916409

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