Observation of swelling behavior of ArF resist during development by using QCM method

Atsushi Sekiguchi; Hiroko Konishi; Mariko Isono

doi:10.1117/12.916038

19 March 2012 Observation of swelling behavior of ArF resist during development by using QCM method

Atsushi Sekiguchi, Hiroko Konishi, Mariko Isono

Proceedings Volume 8325, Advances in Resist Materials and Processing Technology XXIX; 83251N (2012) https://doi.org/10.1117/12.916038
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

Many reports have discussed the swelling behavior of photoresists during development, as observed by the QCM method. Previously, we reported on the development of development analysis equipment based on the QCM method. In this paper, we report on a high-precision resist development analyzer also based on the QCM method. This equipment incorporates a high-precision developing solution temperature controller and features a high-precision air conditioning function for the measurement chamber. We also measured swelling behavior during development using a TBAH developer solution, which features larger molecules than TMAH, comparing these results with those obtained with TMAH. The results of this measurement indicate that the extent of resist swelling during development is less with TBAH developer solution than with TMAH developer solution. This result is consistent with results of a study by Itani et al. using high-speed AFM, suggesting the suitability of the measurement equipment used in our experiments.

Citation Download Citation

Atsushi Sekiguchi, Hiroko Konishi, and Mariko Isono "Observation of swelling behavior of ArF resist during development by using QCM method", Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83251N (19 March 2012); https://doi.org/10.1117/12.916038

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