Gray-level 3D resist process and its application

Yung-Chiang Ting; Shyi-Long Shy; Andy Liu; Cheng-San Wu; C. C. Chen

doi:10.1117/12.915702

19 March 2012 Gray-level 3D resist process and its application

Yung-Chiang Ting, Shyi-Long Shy, Andy Liu, Cheng-San Wu, C. C. Chen

Proceedings Volume 8325, Advances in Resist Materials and Processing Technology XXIX; 83252E (2012) https://doi.org/10.1117/12.915702
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

Gray level 3D resist process were developed by using negative e-beam resist and multiple coating multiple electron beam wafer direct write alignment, and are now going into be used to create complex 3D structures in thick resist. Gray level resist process to create 3D structure in thick resist can be used as mold for manufacturing Fly's-eye lens array, Fresnel lens, Prism, Flat prism and Light guiding plate. Such optical devices can be used for TFT LCD display, solar concentrator and LED.

Citation Download Citation

Yung-Chiang Ting, Shyi-Long Shy, Andy Liu, Cheng-San Wu, and C. C. Chen "Gray-level 3D resist process and its application", Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83252E (19 March 2012); https://doi.org/10.1117/12.915702

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