Stack effect implementation in OPC and mask verification for production environment

Elodie Sungauer; Frederic Robert

doi:10.1117/12.916059

13 March 2012 Stack effect implementation in OPC and mask verification for production environment

Elodie Sungauer, Frederic Robert

Proceedings Volume 8326, Optical Microlithography XXV; 83260C (2012) https://doi.org/10.1117/12.916059
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

With the decrease of the transistors dimensions, process steps usually considered as not critical become challenging. This is the case for implant levels patterning, which can be strongly impacted by reflections from the underlying active and gate patterns, especially when no anti-reflective coating can be used. This stack effect leads to unexpected resist shape on wafer if not taken into account during OPC flow. We propose a solution to integrate stack effect onto existing OPC models by adding fictive layers at mask level in order to allow a stack-aware OPC or mask verification. This method can be implemented in a standard OPC flow offered by EDA OPC software. It provides effective results compatible with production constrains, such as stack-aware full chip simulation and run time efficiency.

Citation Download Citation

Elodie Sungauer and Frederic Robert "Stack effect implementation in OPC and mask verification for production environment", Proc. SPIE 8326, Optical Microlithography XXV, 83260C (13 March 2012); https://doi.org/10.1117/12.916059

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