A study of pattern variability for device performance

Tae-Heon Kim; Dae-Han Han; Ae-Ran Hong; Yong-Hyeon Kim; Joo-Sung Lee; Yun-Hye Chu; Kweon-Jae Lee; Yong-Jik Park

doi:10.1117/12.915934

14 March 2012 A study of pattern variability for device performance

Tae-Heon Kim, Dae-Han Han, Ae-Ran Hong, Yong-Hyeon Kim, Joo-Sung Lee, Yun-Hye Chu, Kweon-Jae Lee, Yong-Jik Park

Proceedings Volume 8327, Design for Manufacturability through Design-Process Integration VI; 83270Y (2012) https://doi.org/10.1117/12.915934
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

As semiconductor process technology scales down to sub 30nm process node and beyond dimensions, the printability and process window of the lithographic patterns are seriously reduced due to the fundamental limit of the lithography and process variations. In this paper, we introduce a various analysis methodology of pattern variability for higher device performance using with applications of DBV (Design Based Verification). Pattern variability is affected by both pattern process margins and electrical margins such as distribution of gate length. Even if post lithography verification would carry out after model based OPC, Pattern variability is increased not only unpredictable OPC hotspots but also unanticipated hotspots by AEI loading skew in full-chip. Secondly, electrical hotspots which are extracted by tail distributions of gate length are not always reliable enough to represent critical path with gate length of full-chip. We constructed New OCV extraction flow with a full-chip pattern classification that is required for both gate distribution accuracy and analysis of gate tail patterns. In this report, we investigated about the relationship between a pattern feature and pattern distribution of transistor length.

Citation Download Citation

Tae-Heon Kim, Dae-Han Han, Ae-Ran Hong, Yong-Hyeon Kim, Joo-Sung Lee, Yun-Hye Chu, Kweon-Jae Lee, and Yong-Jik Park "A study of pattern variability for device performance", Proc. SPIE 8327, Design for Manufacturability through Design-Process Integration VI, 83270Y (14 March 2012); https://doi.org/10.1117/12.915934

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