Consideration of correlativity between litho and etching shape

Ryoichi Matsuoka; Hiroaki Mito; Shinichi Shinoda; Yasutaka Toyoda

doi:10.1117/12.915785

14 March 2012 Consideration of correlativity between litho and etching shape

Ryoichi Matsuoka, Hiroaki Mito, Shinichi Shinoda, Yasutaka Toyoda

Proceedings Volume 8327, Design for Manufacturability through Design-Process Integration VI; 832710 (2012) https://doi.org/10.1117/12.915785
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States

Abstract

We developed an effective method for evaluating the correlation of shape of Litho and Etching pattern. The purpose of this method, makes the relations of the shape after that is the etching pattern an index in wafer same as a pattern shape on wafer made by a lithography process. Therefore, this method measures the characteristic of the shape of the wafer pattern by the lithography process and can predict the hotspot pattern shape by the etching process. The method adopts a metrology management system based on DBM (Design Based Metrology). This is the high accurate contouring created by an edge detection algorithm used wafer CD-SEM. Currently, as semiconductor manufacture moves towards even smaller feature size, this necessitates more aggressive optical proximity correction (OPC) to drive the super-resolution technology (RET). In other words, there is a trade-off between highly precise RET and lithography management, and this has a big impact on the semiconductor market that centers on the semiconductor business. 2-dimensional shape of wafer quantification is important as optimal solution over these problems. Although 1-dimensional shape measurement has been performed by the conventional technique, 2-dimensional shape management is needed in the mass production line under the influence of RET. We developed the technique of analyzing distribution of shape edge performance as the shape management technique. In this study, we conducted experiments for correlation method of the pattern (Measurement Based Contouring) as two-dimensional litho and etch evaluation technique. That is, observation of the identical position of a litho and etch was considered. It is possible to analyze variability of the edge of the same position with high precision.

Citation Download Citation

Ryoichi Matsuoka, Hiroaki Mito, Shinichi Shinoda, and Yasutaka Toyoda "Consideration of correlativity between litho and etching shape", Proc. SPIE 8327, Design for Manufacturability through Design-Process Integration VI, 832710 (14 March 2012); https://doi.org/10.1117/12.915785

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
10 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Etching

Optical proximity correction

Lithography

Photomasks

Semiconducting wafers

Metrology

Semiconductors

Show All Keywords

Keywords/Phrases

Search In:

Publication Years