14 March 2012 Advanced techniques for design assembly and characterization for the 14nm node with LFD using a black box API
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Abstract
The need to quickly and flexibly characterize the design manufacturability increases as circuit design scales beyond the 22nm node. Improvements in design practices and design software are enabling this process. The use of carefully characterized design subunits (cells) in the general assembly of the chip is one way to ensure that products are optimized for these increasingly difficult lithographic process challenges. Additionally, software for assessing design robustness has been enhanced to deal with ever more complex resolution enhancement techniques. State of the art simulator and verification tool sets provide the necessary step of creating simulation contours and process variability bands upon which various checks can then be performed. The construction of these contours and bands is often hidden from the user as traditional single or double exposure processes of one or two masks are assumed to be used to create the final layout pattern.
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Juliann Opitz, Juliann Opitz, Andres Torres, Andres Torres, Ioana Graur, Ioana Graur, Wael Manhawy, Wael Manhawy, Suniti Kanodia, Suniti Kanodia, Marwah Shafee, Marwah Shafee, Sarah Mohamed, Sarah Mohamed, Ahmed Hassand, Ahmed Hassand, Jeanne Bickford, Jeanne Bickford, } "Advanced techniques for design assembly and characterization for the 14nm node with LFD using a black box API", Proc. SPIE 8327, Design for Manufacturability through Design-Process Integration VI, 832711 (14 March 2012); doi: 10.1117/12.916431; https://doi.org/10.1117/12.916431
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