Visit My Account to manage your email alerts.
Dry etching challenges for patterning smooth lines: LWR reduction of extreme ultra violet photo resist
Self-assembly patterning using block copolymer for advanced CMOS technology: optimisation of plasma etching process
Transfer optimized dry development process of sub-32nm HSQ/AR3 BLR resist pillar from low-K etcher to metal etcher
3d modeling of LER transfer from the resist to the underlying substrate: the effect of the resist roughness