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15 November 2011 Strain measurement of weakening groove of separating unit based on 3D digital speckle correlation method
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Proceedings Volume 8335, 2012 International Workshop on Image Processing and Optical Engineering; 833506 (2011) https://doi.org/10.1117/12.917803
Event: 2012 International Workshop on Image Processing and Optical Engineering, 2012, Harbin, China
Abstract
The weakening groove becomes the weaker link in separating unit since it bears axial load, bending moment and shearing force during operating. The strain distribution of weakening groove is obtained by ARAMIS system based on 3D digital speckle correlation method (DSCM). The result indicates that there is stress concentrate band in each groove, and the strain increased from the lower one to the upper ones. The result also demonstrates that the ARAMIS system performed with good results, especially in 3D deformation and stress concentrate measurement.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jiangfan Zhou, Hui Zhang, Wenjing Guo, Hongbo Wang, Guoliang Xu, and Wugang Liu "Strain measurement of weakening groove of separating unit based on 3D digital speckle correlation method", Proc. SPIE 8335, 2012 International Workshop on Image Processing and Optical Engineering, 833506 (15 November 2011); https://doi.org/10.1117/12.917803
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