Interconnects For VHSIC Packaging

D. E. Craley; L. R. Megargel; M. A. Mentzer; D. H. Naqhski

doi:10.1117/12.942372

10 March 1988 Interconnects For VHSIC Packaging

D. E. Craley, L. R. Megargel, M. A. Mentzer, D. H. Naqhski

Proceedings Volume 0835, Integrated Optical Circuit Engineering V; (1988) https://doi.org/10.1117/12.942372
Event: Cambridge Symposium on Fiber Optics and Integrated Optoelectronics, 1987, Cambridge, MA, United States

Abstract

The limitations of conventional interconnects and switching technology are rapidly becoming critical issues in the throughput of data within high-speed signal processors using VHSIC/VLSI chips or GaAs integrated circuits. Optical interconnect technology promises to significantly enhance signal processing systems and provide relief from pinout, physical proximity, and clocking problems. Furthermore, by releasing the bandwidth constraints imposed by electrical interconnects, the full processing capability of VHSIC chips could be exploited to improve currently fielded systems. Practical interconnection at the intraboard, backplane, and cabinet levels of signal processor systems can now be realized with optical interconnects.

Citation Download Citation

D. E. Craley, L. R. Megargel, M. A. Mentzer, and D. H. Naqhski "Interconnects For VHSIC Packaging", Proc. SPIE 0835, Integrated Optical Circuit Engineering V, (10 March 1988); https://doi.org/10.1117/12.942372

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