Mask industry assessment trend analysis: 2012

Y. David Chan

doi:10.1117/12.923746

16 April 2012 Mask industry assessment trend analysis: 2012

Y. David Chan

Author Affiliations +

Proceedings Volume 8352, 28th European Mask and Lithography Conference; 835203 (2012) https://doi.org/10.1117/12.923746
Event: 28th European Mask and Lithography Conference (EMLC 2012), 2012, Dresden, Germany

Abstract

Microelectronics industry leaders consistently cite the cost and cycle time of mask technology and mask supply among the top critical issues for lithography. A survey was designed by SEMATECH with input from semiconductor company mask technologists and merchant mask suppliers to objectively assess the overall conditions of the mask industry. With the continued support of the industry, this year's assessment was the tenth in the current series of annual reports. This year's survey is basically the same as the 2005 through 2011 surveys. Questions are grouped into six categories: General Business Profile Information, Data Processing, Yields and Yield Loss Mechanisms, Delivery Times, Returns, and Services. Within each category is a multitude of questions that ultimately produce a detailed profile of both the business and technical status of the critical mask industry. We received data from 11 companies this year, which was a record high since the beginning of the series. The responding companies represented more than 96% of the volume shipped and about 90% of the 2011 revenue for the photomask industry. These survey reports are often used as a baseline to gain perspective on the technical and business status of the mask and microelectronics industries. They will continue to serve as a valuable reference to identify strengths and opportunities. Results can also be used to guide future investments in critical path issues.

Citation Download Citation

Y. David Chan "Mask industry assessment trend analysis: 2012", Proc. SPIE 8352, 28th European Mask and Lithography Conference, 835203 (16 April 2012); https://doi.org/10.1117/12.923746

ACCESS THE FULL ARTICLE

PROCEEDINGS
13 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY