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16 April 2012 Integrated cleaning and handling automation of NXE3100 reticles
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Proceedings Volume 8352, 28th European Mask and Lithography Conference; 83520U (2012) https://doi.org/10.1117/12.923321
Event: 28th European Mask and Lithography Conference (EMLC 2012), 2012, Dresden, Germany
Abstract
This paper focuses on imec's activities to minimize particle contamination on reticles (front- and backside) for the latest EUVL scanner, i.e. the NXE3100. Mask cleaning is performed on the HamaTech MaskTrack Pro® (MTP). Although also front-side particles and other contamination are being tackled by cleaning, the prime purpose is the avoidance of back-side particles which would lead to unacceptable overlay performance of the scanner and hence create yield loss, as well as cause unscheduled scanner down situations for cleaning of the reticle clamp. In the absence of a soft pellicle, the present approach to minimize particle adders during handling is to load EUV reticles into the scanner via so-called dual pods. The inner pod as such acts as a removable hard pellicle. Through the installation of the HamaTech MaskTrack Pro InSync® tool, interfaced to the MaskTrack Pro Cleaner, automated handling of EUV reticles in such pods is enabled. This integrated solution for handling and storage is additionally being equipped with an integrated reticle back-side inspection capability.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Rik Jonckheere, Tobias Waehler, Bart Baudemprez, Uwe Dietze, Peter Dress, Oliver Brux, and Kurt Ronse "Integrated cleaning and handling automation of NXE3100 reticles", Proc. SPIE 8352, 28th European Mask and Lithography Conference, 83520U (16 April 2012); https://doi.org/10.1117/12.923321
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