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31 May 2012Current progress on pixel level packaging for uncooled IRFPA
Vacuum packaging is definitely a major cost driver for uncooled IRFPA and a technological breakthrough is still
expected to comply with the very low cost infrared camera market. To address this key issue, CEA-LETI is developing a
Pixel Level Packaging (PLP) technology which basically consists in capping each pixel under vacuum in the direct
continuation of the wafer level bolometer process. Previous CEA-LETI works have yet shown the feasibility of PLP
based microbolometers that exhibit the required thermal insulation and vacuum achievement.
CEA-LETI is still pushing the technology which has been now applied for the first time on a CMOS readout circuit. The
paper will report on the recent progress obtained on PLP technology with particular emphasis on the optical efficiency of
the PLP arrangement compared to the traditional microbolometer packaging. Results including optical performances,
aging studies and compatibility with CMOS readout circuit are extensively presented.
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G. Dumont, W. Rabaud, J.-J. Yon, L. Carle, V. Goudon, C. Vialle, Sébastien Becker, Antoine Hamelin, A. Arnaud, "Current progress on pixel level packaging for uncooled IRFPA," Proc. SPIE 8353, Infrared Technology and Applications XXXVIII, 83531I (31 May 2012); https://doi.org/10.1117/12.919918