Critical Issues In Free Space Intrachip Optical Interconnect Technology

Michael R. Feldman; Sadik C. Esener; Clark C. Guest; Sing H. Lee

doi:10.1117/12.967549

1 January 1987 Critical Issues In Free Space Intrachip Optical Interconnect Technology

Michael R. Feldman, Sadik C. Esener, Clark C. Guest, Sing H. Lee

Proceedings Volume 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects; (1987) https://doi.org/10.1117/12.967549
Event: Cambridge Symposium on Fiber Optics and Integrated Optoelectronics, 1987, Cambridge, MA, United States

Abstract

Conditions are determined for which free space optical interconnects can transmit information at a higher data rate and consume less power than the equivalent electrical interconnections. Effects of circuit dimension scaling and improved optical link efficiency are discussed. The packing densities of optical and electrical interconnects are also compared.

Citation Download Citation

Michael R. Feldman, Sadik C. Esener, Clark C. Guest, and Sing H. Lee "Critical Issues In Free Space Intrachip Optical Interconnect Technology", Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); https://doi.org/10.1117/12.967549

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