Integrated Optics Approach For High-Density Optical Interconnections In High-Speed Multichip IC Packages

Charles T. Sullivan; Martha Connors Roth; Teresa Budzynski

doi:10.1117/12.967550

1 January 1987 Integrated Optics Approach For High-Density Optical Interconnections In High-Speed Multichip IC Packages

Charles T. Sullivan, Martha Connors Roth, Teresa Budzynski

Proceedings Volume 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects; (1987) https://doi.org/10.1117/12.967550
Event: Cambridge Symposium on Fiber Optics and Integrated Optoelectronics, 1987, Cambridge, MA, United States

Abstract

The area requirements for routing and distributing guided-wave optical signals using gradual waveguide curves and branches will severely restrict the utilization of optical interconnects in future multichip IC packages. This paper addresses the use of total internal reflection in abrupt guided-wave optical components for realizing high-density optical interconnect circuits that eliminate this area constraint. We have measured excess insertion losses of 0.2-0.5 dB at 830 nm for 90° waveguide corner bends, branches, and crossovers for both E^y and E^x polarizations in 5-micron- and 10-micron-wide multimode channels. These loss figures are expected to provide sufficient optical power margins for all point-to-point interconnects in a targeted high-speed multichip VLSI/GaAs package for signal processing applications.

Citation Download Citation

Charles T. Sullivan, Martha Connors Roth, and Teresa Budzynski "Integrated Optics Approach For High-Density Optical Interconnections In High-Speed Multichip IC Packages", Proc. SPIE 0836, Optoelectronic Materials, Devices, Packaging, and Interconnects, (1 January 1987); https://doi.org/10.1117/12.967550

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