Printed assembly of micro/nanostructured semiconductor materials for high-performance unusual format photovoltaics

Jongseung Yoon

doi:10.1117/12.919646

7 May 2012 Printed assembly of micro/nanostructured semiconductor materials for high-performance unusual format photovoltaics

Jongseung Yoon

Author Affiliations +

Proceedings Volume 8373, Micro- and Nanotechnology Sensors, Systems, and Applications IV; 83731E (2012) https://doi.org/10.1117/12.919646
Event: SPIE Defense, Security, and Sensing, 2012, Baltimore, Maryland, United States

Abstract

Unconventional approaches to exploit established materials in photovoltaics can create novel engineering opportunities, device functionalities, and cost structures, each of which can have significant values in different technological applications. Here, I present an overview of materials and integration strategies that involve a large collection of monocrystalline silicon in micro and nanostructured forms that are derived from wafer-based source materials. Printinglike assembly techniques offered a practical means to manipulate ultrathin, micro/nanoscale building blocks in a massively parallel, cost-effective manner, thereby enabling device- and module-level integration on various classes of foreign substrates with advantages in areal coverages, formats, and costs that have been difficult in conventional crystalline silicon photovoltaics.

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Jongseung Yoon "Printed assembly of micro/nanostructured semiconductor materials for high-performance unusual format photovoltaics", Proc. SPIE 8373, Micro- and Nanotechnology Sensors, Systems, and Applications IV, 83731E (7 May 2012); https://doi.org/10.1117/12.919646

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