Paper
3 April 2012 Piezoceramic materials shear response: approximate modal coupling and analysis
Ayech Benjeddou
Author Affiliations +
Proceedings Volume 8409, Third International Conference on Smart Materials and Nanotechnology in Engineering; 840913 (2012) https://doi.org/10.1117/12.923290
Event: Third International Conference on Smart Materials and Nanotechnology in Engineering, 2011, Shenzhen, China
Abstract
Focus is here made on the approximate modal coupling evaluation and response analysis of the piezoceramic materials d15 shear-mode response. Hence, different evaluation techniques of the effective modal coupling are assessed and twodimensional (2D) plane strain and plane stress free-vibration problems, under short-circuit and approximate, without equipotential (EP) constraints, and accurate, with EP, open-circuit electric conditions, are investigated with ANSYSr 2D and three-dimensional finite elements for a literature shear-mode piezoceramic sandwich beam benchmark with different filling foams. It is shown that the EP physical constraints reduce dramatically the effective coupling, and the plane stress and strain results depend strongly on the filling foam stiffness.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Ayech Benjeddou "Piezoceramic materials shear response: approximate modal coupling and analysis", Proc. SPIE 8409, Third International Conference on Smart Materials and Nanotechnology in Engineering, 840913 (3 April 2012); https://doi.org/10.1117/12.923290
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KEYWORDS
Foam

3D modeling

Electrodes

Nanoimprint lithography

Performance modeling

Visualization

Analytical research

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