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1 November 2012 Polariscopic and interferometric measurements of the mechanical stress
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Proceedings Volume 8411, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VI; 84110M (2012) https://doi.org/10.1117/12.966395
Event: Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2012, 2012, Constanta, Romania
Abstract
Optoelectronic techniques can be applied for the study of transparent objects, followed by the processing of the recorded images on a video camera, after the laser beam passes through the investigated object. In this paper we present our study on a polycarbonate plate with optical polished surfaces, subjected on mechanical stresses perpendicular to the laser beam propagation axis. The results of this study include the values for material constants. Three experimental arrangements were employed: a plane polariscope, a circular polariscope and an interferometric setup. The recorded images in coherent light contain fringes variation with increased mechanical stress. They are processed using our MATLAB codes to determine the state of the stress at various points in the investigated sample. The measurements in a polariscopic assembly demonstrate the photoelastic properties of this composite material. In the plane polariscope arrangement, we can visualize the main stress directions and also the points with equal maximum shear stress magnitude; in circular polariscope we can visualize only the points with equal maximum shear stress magnitude; and in the interferometric setup are highlighted the refractive index variations which are linked with the phase changes and the applied stress. We apply the shift theorem from the Fourier theory, on the experimental images from the interferometric setup and on simulated ones.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Alina Georgiana Ilie, Mona Mihailescu, Raluca Augusta Gabor, Olguta Curcan, and Cristi-Andi Nicolae "Polariscopic and interferometric measurements of the mechanical stress", Proc. SPIE 8411, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VI, 84110M (1 November 2012); https://doi.org/10.1117/12.966395
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