8 May 2012 Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode
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Abstract
We present investigations of light-scattering thermal cross-link package film based on self-assembly for liquid crystal display using light emitting diode. Thermal cross-link package films based on selfassembly indicated good nano regularly-structured patterning for light-scattering, excellent environmental stability of optical parameters, and solvent intermixing resistance after thermal cross-link reaction. The developed light-scattering thermal cross-link package film-s based on self-assembly is one of the most promising processes ready to be incorporated into the mass production of patterning light-scattering optical layer for advanced liquid crystal display, organic electroluminescent display, and solar cell devices.
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Satoshi Takei, Kazuhide Mochizuki, Naoya Kubo, Yoshiyuki Yokoyama, "Development of light-scattering thermal cross-linking package film based on self-assembly for liquid crystal display using light emitting diode", Proc. SPIE 8428, Micro-Optics 2012, 84281T (8 May 2012); doi: 10.1117/12.924633; https://doi.org/10.1117/12.924633
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