17 September 2012 Progress with MEMS x-ray micro pore optics
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Abstract
Our development of ultra light-weight X-ray micro pore optics based on MEMS (Micro Electro Mechanical System) technologies is described. Using dry etching or X-ray lithography and electroplating, curvilinear sidewalls through a flat wafer are fabricated. Sidewalls vertical to the wafer surface are smoothed by use of high temperature annealing and/or magnetic field assisted finishing to work as X-ray mirrors. The wafer is then deformed to a spherical shape. When two spherical wafers with different radii of curvature are stacked, the combined system will be an approximated Wolter type-I telescope. This method in principle allows high angular resolution and ultra light-weight X-ray micro pore optics. In this paper, performance of a single-stage optic, coating of a heavy metal on sidewalls with atomic layer deposition, and assembly of a Wolter type-I telescope are reported.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuichiro Ezoe, Teppei Moriyama, Tomohiro Ogawa, Takuya Kakiuchi, Takaya Ohashi, Ikuyuki Mitsuishi, Kazuhisa Mitsuda, Mitsuhiro Horade, Susumu Sugiyama, Raul E. Riveros, Hitomi Yamaguchi, Yoshiaki Kanamori, Kohei Morishita, Kazuo Nakajima, Ryutaro Maeda, "Progress with MEMS x-ray micro pore optics", Proc. SPIE 8443, Space Telescopes and Instrumentation 2012: Ultraviolet to Gamma Ray, 84430U (17 September 2012); doi: 10.1117/12.925811; https://doi.org/10.1117/12.925811
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KEYWORDS
X-ray optics

X-rays

Wafer-level optics

Semiconducting wafers

Silicon

Microelectromechanical systems

Spatial resolution

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